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参考专利及文献

参考专利(相关单位)

  • 一种基于指示函数的交叉传递函数快速分解方法(苏州珂晶达电子有限公司)
  • 基于极坐标采样的交叉传递函数快速分解方法(苏州珂晶达电子有限公司)
  • 基于光源互强度函数分解的光学成像快速计算方法(苏州珂晶达电子有限公司)
  • 一种基于卷积核的集成电路光刻制造建模方法(浙江大学)
  • 使用主分量分析的紧凑abbe内核生成(新思科技有限公司)
  • 辅助特征的基于规则部署(ASML荷兰有限公司)

参考文献

  • Mack C A. Field guide to optical lithography[M]. Bellingham, WA: SPIE Press, 2006.
  • Gamo H. Intensity matrix and degree of coherence[J]. JOSA, 1957, 47(10): 976-976.
  • Gamo H. III Matrix treatment of partial coherence[M]//Progress in Optics. Elsevier, 1964, 3: 187-332.
  • Gamō H. Transformation of intensity matrix by the transmission of a pupil[J]. JOSA, 1958, 48(2): 136-137.
  • Gamo H. Mathematical analysis of the intensity distribution of optical image in various degree of coherence illumination[J]. Jpn. J. Appl. Phys., 1968, 25: 431-436.
  • Gamo H. The sampling theorem for the image obtained by a circular aperture and its applications to numerical calculation of amplitude, intensity and their Fourier transforms with analytical expression of response functions(Image sampling theorems for wave amplitudes obtained with circular apertures including Fourier-Bessel transformations and Airy figure example)[J]. 1971.
  • Köhle R. Fast TCC algorithm for the model building of high NA lithography simulation[C]//Optical Microlithography XVIII. International Society for Optics and Photonics, 2005, 5754: 918-929.
  • Wong A K K. Resolution enhancement techniques in optical lithography[M]. SPIE press, 2001.
  • Lian Y, Zhou X. Fast and accurate computation of partially coherent imaging by stacked pupil shift operator[C]//Photomask Technology 2009. International Society for Optics and Photonics, 2009, 7488: 74883G.
  • Hopkins H H. The concept of partial coherence in optics[J]. Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1951, 208(1093): 263-277.
  • 韦亚一,超大规模集成电路先进光刻理论与应用[M],科学出版社,2016.
  • Wu, Qiang. "An optical proximity model for negative toned developing photoresists." 2018 China Semiconductor Technology International Conference (CSTIC). IEEE, 2018.
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